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Polishing Liquid

Chemical Mechanical Planarization (CMP), also known as Chemical Mechanical Polishing, is a combination of mechanical abrasion and chemical corrosion techniques. It relies on the abrasive action of ultra-fine particles and chemical corrosion to create a smooth and flat surface on the polished medium. CMP technology is a new polishing technique mainly used in the semiconductor manufacturing industry. The main components of the CMP process are the workpiece, the polishing pad, and the polishing liquid. Polishing liquid is generally composed of abrasives, oxidizing agents, and balancing solvents such as deionized water or alcohol, and may also contain some additives based on specific conditions. The polishing liquid provides chemical action through the solution chemistry and mechanical action through the abrasives. Abrasives play a crucial role in transmitting mechanical energy to the polished surface. To achieve better polishing results, it is necessary to control the particle size, hardness, and dispersion of the abrasives. The abrasive size should be less than 1µm, as excessively large or small abrasive sizes can increase scratches on the polished surface and reduce polishing quality. Filtering the polishing liquid is a method to improve polishing quality, and selecting an appropriate filtration system can effectively enhance the polishing performance of the polishing liquid.

Filtration Purpose

● To remove impurities such as oversized particles and agglomerates while retaining suitable polishing abrasive particles.

Application Requirements

● Low dissolution of filter media during the filtration process, with no medium shedding.

● The filter has been rinsed with pure water, and the total organic carbon (TOC) content is within the specified range.

● The terminal filter has excellent reliability and durability in controlling impurity particles, ensuring that contaminants are not unloaded when flow or pressure changes occur.

● High flow rate, sturdy structure, and strong filtering capacity to meet the requirements of polishing liquid filtration.